Atlas Journal of Materials Science – ISSN 2330-6831

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Journal Information
Aims and Scope
Editorial Board
Authors Guidelines
Manuscript Submission
Table of Contents

Journal Information

Atlas Journal of Materials Science is an open access, peer-reviewed international journal that publishes original research articles, short communications, technical notes, and comprehensive review articles in all fields of Materials Science and Engineering.

Atlas Journal of Materials Science charges $309.99 per manuscript published.

Atlas Journal of Materials Science is now indexed in the following databases:

All articles in Atlas journals are distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/3.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Aims and Scope

Atlas Journal of Materials Science aims at the rapid publication for open access to promote the research in the materials science community. It accepts original research articles, short communications, technical notes, and comprehensive review articles on all aspects of materials science research, including but not limited to the materials fabrication, processing, properties and computations of any types of materials, covering metals and alloys, ceramics, polymers, composites, nanomaterials, biomaterials, and so on.

Editorial Board

Editor-In-Chief

Zhiping Luo, Fayetteville State University, USA

Editorial Board Members

Chien-Chon Chen, National United University, Taiwan

Dong Fang, Wuhan Textile University, China

Ibrahim Karaman, Texas A&M University, USA

Benat Kockar, Hacettepe University, Turkey

Subrata Kundu, Central Electrochemical Research Institute, India

Marcus A. Hunt, Fayetteville State University, USA

Verónica Paredes-García, Universidad Andrés Bello, Chile

Zewei Quan, Los Alamos National Laboratory, USA

Vijaya K Rangari, Tuskegee University, USA

Kai Sun, University of Michigan, USA

Luyi Sun, University of Connecticut, USA

Yong Zhang, Massachusetts Institute of Technology, USA

Hongxing Zheng, Shanghai University, China